Sputter deposition is a PVD method of depositing thin films by plasma sputtering. Sputtering effectively “knocks off” the material to be sputtered via a high energy, ionized atom (typically Ar). The material sputtered or knocked off from the sputter target then impinges on and typically sticks to the substrate, usually a wafer. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV.

The availability of many parameters that control sputter deposition make it a complex process, but also allow for a large degree of control over the growth and microstructure of the film.  Being able to monitor and control the deposition process through the use of kSA in situ metrology tools provides great insight into these sputtering conditions.