In Situ tool for measuring real-time film stress, film strain, and wafer curvature induced by thin films or thermal processes on a substrate/wafer.


In Situ tool for measuring real-time film stress, film strain, and wafer curvature induced by thin films or thermal processes on a substrate/wafer.

MOS Module: In situ modular tool for measuring real-time film stress, film strain and wafer curvature induced by thin films or thermal processes on a substrate/wafer, ideal for MOCVD reactors with high speed or low speed rotation and limited optical access.

Ex situ tool with full 2D wafer mapping, for measuring film stress, film strain, and wafer curvature, bow, and tilt induced by thin films or thermal processes on a substrate/wafer.
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